From 2017 to 2018, we provided 4,000 linear motor modules and die bonding platforms to the semiconductor industry manufacturer Weiheng Automation every year.
More than 40 units are supplied per day.
The customer's production capacity is increased to 60K/H, and the wafer is 6mil.
Replacing the customer's previous screw drive, the cost increased by 10%, while the production capacity increased by 40%, the mechanical loss decreased by more than 50%, and the after-sales cost decreased by 30%.